> fanless cooling solutions which tends to degrade after a few years.
Thermal expansion/contraction between cooler and chip itself "pumps" out the thermal paste which over time degrades cooling performance. If the system is running 24/7 its probably not as noticeable because you don't get the frequent heating/cooling you'd see on a device that gets power cycled often.
is it theoretically possible to have cooling paste be jelly like? so it just returns to previous position after cooling down? or its just to irrelevat problem to invest in it?
There are thermal pads that perform equally or better than thermal pastes, due to their design. In particular, something like https://thermalmanagement.honeywell.com/us/en/products/therm... can be better than a good thermal paste like https://www.thermal-grizzly.com/en/products/16-kryonaut-en. The thermal conductivity is improved due to the use of a phase shifting material. Reliability is improved due to the fact that it will naturally return to solid without cracking during heat cycling.
Are there designs that don't use thermal paste? As I understand it regardless of solution you need paste or live with significantly reduced conductivity. That goes for any system - fan cooled, liquid cooled, passive,...
Graphite thermal pads are available for consumers (e.g: Thermal Grizzly Carbonaut,
IC Diamond Graphite) which offer similar performance (within 5°C) to paste without this issue.
Edit: to answer my own question it looks like Apple uses thermal paste but the cooling in the M2 MacBook Air looks extremely flimsey to the point of being almost non-existent. I doubt it will be affected much at all by this.
You're looking for phase change materials (PCM), which soften at the desired operating temperature. Prevents pumping out because it's still mostly-solid.
>> Are there designs that don't use thermal paste?
Yes. Glue. Paste is for when you might want to one day separate part from heatsink. If you don't care about repairs, it is perfectly reasonable to just glue them together with thermal adhesive.
Thermal expansion/contraction between cooler and chip itself "pumps" out the thermal paste which over time degrades cooling performance. If the system is running 24/7 its probably not as noticeable because you don't get the frequent heating/cooling you'd see on a device that gets power cycled often.
Nothing a repaste job wont fix.
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